Industry-Sponsored Research Week
University-Industry Engagement Advisor

Toyota Material Handling North America accepting research proposals

By David Schwartz
Published: September 11th, 2018

Toyota Material Handling North America (TMHNA) announced it has begun accepting applications for the third annual TMHNA University Research Program, a sponsored research initiative created to advance innovations in the material handling industry.

The program is accepting proposals via its website, (click here) now through Dec. 15, 2018.

Research proposals from full-time researchers at North American universities will be evaluated for their impact on the future of the industry, as well as the planning and feasibility of the timeline and budget. Winning proposals will announced in April 2019.

“Creative thinking and progressive problem-solving are what continue to advance our industry,” said Brett Wood, president and chief executive officer with Toyota Material Handling North America. “This program perfectly personifies those qualities and aligns with our mission to provide our customers with solutions that are smarter, more efficient and more effective. We’re excited to see how this year’s applicants apply their knowledge of engineering and various technical fields to draw synergies between collegiate research and the material handling industry.”

Proposals selected for funding last year included virtual reality (VR) and augmented reality (AR), energy infrastructure, and Internet of Things (IoT) technologies. While there are no restrictions on research focus, TMHNA is encouraging proposals in these areas:

  • Material handling for last-mile delivery, urban environments, piece-picking, reverse logistics and automation;
  • Remote operation of material handling equipment;
  • Warehousing energy infrastructure;
  • VR/AR for material handling applications;
  • Machine learning in material handling;
  • Advanced driver-assistance systems (ADAS) for material handling equipment;
  • Industry 4.0.

Source: Modern Materials Handling

Posted under: University-Industry Engagement Week

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