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IP Group and U of Washington launch start-up around bodily sensor technology

By Jesse Schwartz
Published: November 23rd, 2021

IP Group, a leading technology commercialization company, and CoMotion, the tech transfer arm and start-up accelerator at the University of Washington (UW), have partnered to launch a new nanotechnology company developing a state-of-the-art bodily sensor.

Somalytics Inc. aims to commercialize a miniature, paper carbon nanotube capacitive sensor developed at UW that is flexible and highly sensitive to the human body. The start-up is developing skin, eye and gesture monitoring sensors that could be applied to a range of areas including consumer electronics, transportation, health and wellness, and the Internet of Things.

“This technology could be as transformational for the human experience as the mobile phone,” says Barbara Barclay, CEO of Somalytics. “The uses are limitless and highly beneficial to improving the human condition and our interactions with the digital world. We look forward to building partnerships with major influencers in global markets to rapidly bring this disruptive technology to market, the potential of which is estimated at over $15 billion.”

Somalytics’ sensors are composed of carbon nanotubes that are 10 thousandth the size of a human hair. Despite their small size, the sensors provide a particularly strong detection signal while emitting an extremely low power consumption footprint.

“Through the power of this new patent-pending nanotechnology and our ability to mass manufacture it in the U.S., we will be pioneering the evolution of capacitive engineering and opening a new era for human-computer interface,” says Jae-Hyun Chung, associate professor at UW and co-founder of Somalytics.

“Our technology will be able to replace and surpass the capabilities of earlier human-computer interaction technology such as eye tracking as well as assistive devices,” adds Chung. “The potential is incredible, and we look forward to making it a reality.”

Source: Business Wire

Posted under: Tech Transfer e-News

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